Electronics Component & Packaging (ECP) Soldering
All-in-one solution for ECP soldering
Air Liquide has supported the electronics manufacturing industry with solutions for every step of their processes from assembly through testing, storage and cleaning.
ECP Soldering at a glance
In the assembly of electronic components, oxidation reaction, poor wettability and high peak temperature during soldering of printed circuit boards create harm to electronic solder joints. To offset these effects, using nitrogen to inert the atmosphere during soldering has become a globally accepted practice within electronics manufacturing.
Our Nexelia™ solutions are a range of all-in-one solutions for the electronics manufacturing industry.
As assembly is a focused core process, we offer solutions to achieve controlled nitrogen atmospheres, thereby reducing the negative effects of oxidation for wave or reflow soldering. The Nexelia™ offers for electronics manufacturing include the following solutions:
- Nexelia™ for Wave Soldering is a solution dedicated to the wave soldering process. It includes patented customized application equipment, right inert gas supply and the support of our worldwide experts.
- Nexelia™ for Reflow Soldering is a solution dedicated to reflow soldering process. It involves deep-level inspection and diagnostics to understand the customer’s assembly processes and propose a tailored solution to improve them.
Why choose us
We are a global leader in gases, technologies and services for Industry and Health.
We have a global network of experts available to support you in developing solutions to meet your specifications and challenges.
Extensive & Reliable Infrastructure Network
We have production and filling facilities and pipeline networks across Australia to guarantee reliability and safety.
One-Stop Solution Provider for your needs
We provide a full range of products in various purities and supply modes and a spectrum of services to meet your specific needs.